Inspection of Internal Bonding Wire of Semiconductor Integrated Circuit by Image Processing
نویسندگان
چکیده
منابع مشابه
Illumination system for wire bonding inspection.
A novel lighting system was devised for 3D defect inspection in the wire bonding process. Gold wires of 20 microm in diameter were bonded to connect the integrated circuit (IC) chip with the substrate. Bonding wire defects can be classified as 2D type and 3D type. The 2D-type defects include missed, shifted, or shorted wires. These defects can be inspected from a 2D top-view image of the wire. ...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering, Contributed Papers
سال: 2004
ISSN: 1881-8722,1348-8724
DOI: 10.2493/jspe.70.230